Research Progress of the Packaging Techniques for Uncooled Infrared Focal Plane Arrays
计量
- 文章访问数: 306
- HTML全文浏览量: 43
- PDF下载量: 86
- 被引次数: 2
引用本文: | 王强, 张有刚. 非制冷红外焦平面探测器封装技术研究进展[J]. 红外技术, 2018, 40(9): 837-842. |
Citation: | WANG Qiang, ZHANG Yougang. Research Progress of the Packaging Techniques for Uncooled Infrared Focal Plane Arrays[J]. Infrared Technology , 2018, 40(9): 837-842. |