Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009
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Citation:
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Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009
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Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009
|
Citation:
|
Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009
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